Paste
SIL-LUB 65
Silicone Heat Sink Compound
DESCRIPTION
SIL-LUB 65 Heat Sink Compound is typically a white paste. It is
Silicone base grease like material, which improve the thermal connection
between the processor and heat sink. A thin layer of this is spread
between the two, which greatly improves heat transfer and the cooling.
SIL-LUB 65 is recommended as a heat transfer medium for use with
all electronic components such as power transistors, diodes, resistors,
etc. Type 65 is created to meet the need for a non-contaminating
and more efficient thermal transfer compound. It has a life
expectancy
far exceeding that of all known types of electronic circuitry in
both normal and extreme environments.
SIL-LUB 65 is high-efficiency heat transfer compound. It ensures
smooth contact and heat removal. It removes air gaps between microprocessors
and heat sink.
Application Instructions: Use a wood stick to apply a small quantity
of the thermal compound on the heat sink where contact is made with
the processor. The contact area is much smaller than the physical
size of the cooler and the processor. Spread the compound slightly
on the heat sink to cover the contact area with a thin film. Attach
the heat sink to the processor. Move the heat sink slightly and
gently against the processor. The goal is to eliminate the air gap.
The heat generated by the processor once running will help dispersing
the compound evenly. Do not over apply the paste.
Uses: Transistors, Diodes, rectifiers, transformers, processors.
| Typical Specification: |
|
| Colour |
White |
| Texture |
Smooth |
| Penetration, worked 0.1mm |
280 |
| Dropping Point Deg. C |
250 |
| Bleed at 24 hrs @ 200 Deg.C |
0.1% |
| Evaporation at 24 hrs @ 200 Deg. C |
: 0.3% |
| Dielectric Strength |
600 vol/mil |
| Dielectric Constant, 50 Hz |
4.95 |
| Dielectric Constant, 100 Hz |
: 4.90 |
| Breakage Voltage 0.01” gap |
: 6100 volts |
| Thermal conductivity, 36°C |
1.8 x 10-3 cal/sec/cm-1°K |
